US Patent Issued to INGENTEC on Dec. 2 for "Wafer defect analyzing device and wafer defect analyzing method" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,487,188, issued on Dec. 2, was assigned to INGENTEC Corp. (Miaoli County, Taiwan).

"Wafer defect analyzing device and wafer defect analyzing method" was invented by Chia-Liang Lin (Miaoli County, Taiwan), Ai-Sen Liu (Miaoli County, Taiwan), Cheng-Yu Chung (Miaoli County, Taiwan), Hsiang-An Feng (Miaoli County, Taiwan) and Ya-Li Chen (Miaoli County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer defect analyzing device includes a light source, an imaging mechanism, a height adjusting mechanism and a processor. The light source is configured to carry a wafer and to emit an infrared light. The imaging mechanism includes a camera facing toward...