ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,621, issued on May 13, was assigned to Infinera Corp. (San Jose, Calif.).
"Hybrid integrated circuit package" was invented by John W. Osenbach (Kutztown, Pa.) and Jiaming Zhang (Macungie, Pa.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are multi-layer substrates for integrated circuit packages and methods of making the same. The multi-layer substrate may comprise a plurality of lower layers, at least one core layer, a plurality of upper layers, and a side surface. A first connection and a second connection may extend through or on an uppermost layer of the plurality of upper layers. A trace may be embedded in or on one of the plu...