ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,031, issued on Feb. 4, was assigned to Infinera Corp. (San Jose, Calif.).
"Thermal interface material containment" was invented by John W. Osenbach (Kutztown, Pa.), Gannon Reichert (Bethlehem, Pa.) and Vinh Nguyen (Orefield, Pa.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods of providing a bare circuit integrated circuit package with a containment ring are described. The bare circuit integrated circuit package may be provided with a substrate connected to a printed circuit board. An integrated circuit may be connected to the substrate. A stiffener ring that surrounds the integrated circuit may be attached to the substrate. A heat ...