US Patent Issued to Infineon Technologies on Sept. 30 for "Embedded package with shielding pad" (German, Austrian, American Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,367, issued on Sept. 30, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Embedded package with shielding pad" was invented by Robert Fehler (Regensburg, Germany), Angela Kessler (Sinzing, Germany), Kushal Kshirsagar (Fremont, Calif.), Emanuele Bodano (Villach, Austria) and Martin Benisek (Regensburg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a laminate package substrate, first and second power transistor dies embedded within the laminate package substrate, a driver die embedded within the laminate package substrate, a plurality of I/O routings electrically connected with I/O terminals of...