US Patent Issued to Infineon Technologies on Sept. 30 for "Device including semiconductor chips and method for producing such device" (German Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,450, issued on Sept. 30, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Device including semiconductor chips and method for producing such device" was invented by Petteri Palm (Regensburg, Germany) and Thorsten Scharf (Regensburg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes a first semiconductor chip including a first face, wherein a first contact pad is arranged over the first face. The device further includes a second semiconductor chip including a first face, wherein a first contact pad is arranged over the first face, wherein the first semiconductor chip and the second semiconductor chip are arrange...