US Patent Issued to Infineon Technologies on Sept. 23 for "Chip separation supported by back side trench and adhesive therein" (German Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,495, issued on Sept. 23, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Chip separation supported by back side trench and adhesive therein" was invented by Gunther Mackh (Neumarkt, Germany) and Martin Brandl (Brennburg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of separating an electronic chip from a wafer is disclosed. In one aspect, the method comprises forming at least one trench in a back side of the wafer around at least part of the electronic chip to be separated, forming a back side metallization covering at least part of the back side and at least part of the at least one trench and attaching an adhesi...