ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,654, issued on Oct. 28, was assigned to Infineon Technologies AG (Neubiberg, Germany).
"Power semiconductor modules" was invented by Marco Ludwig (Wickede, Germany) and Guido Boenig (Warstein, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor module arrangement includes at least one substrate comprising a dielectric insulation layer and a first metallization layer attached to the dielectric insulation layer; at least one semiconductor body arranged on the first metallization layer; a housing at least partly enclosing the substrate, the housing comprising sidewalls; and at least one press-on pin, wherein each press-on pin i...