US Patent Issued to Infineon Technologies on Oct. 21 for "Semiconductor die with sensor section located at the edge" (German Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,291, issued on Oct. 21, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor die with sensor section located at the edge" was invented by Momtchil Stavrev (Dresden, Germany) and Dirk Meinhold (Dresden, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die is proposed, wherein the semiconductor die comprises a microelectronic section and a sensor section. The microelectronic section comprises an integrated circuit. The sensor section adjoins an edge of the semiconductor die. A sensor is also proposed, which comprises such a semiconductor die."

The patent was filed on Aug. 25, 2021, under Application No. ...