US Patent Issued to Infineon Technologies on Nov. 4 for "Power semiconductor module with vibration dampeners and power electronics system including the power semiconductor module" (German Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,148, issued on Nov. 4, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Power semiconductor module with vibration dampeners and power electronics system including the power semiconductor module" was invented by Marco BaBler (Oeversee, Germany) and Michael Niendorf (Verl, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor module includes: an electrically insulative enclosure; a plurality of power semiconductor dies attached to a substrate inside the electrically insulative enclosure; a lead frame or clip frame disposed above the power semiconductor dies inside the electrically insulative enclosure and electrica...