US Patent Issued to Infineon Technologies on Nov. 25 for "Power semiconductor module arrangements and methods for producing power semiconductor module arrangements" (German Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,725, issued on Nov. 25, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Power semiconductor module arrangements and methods for producing power semiconductor module arrangements" was invented by Andre Arens (Ruthen, Germany) and Martin Goldammer (Soest, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor module arrangement includes a housing that includes sidewalls, a lid, protrusions, a substrate, a plurality of components arranged on the substrate, and an encapsulant partly filling the interior of the housing, thereby covering the substrate, wherein each of the protrusions extends from the lid of the housin...