US Patent Issued to Infineon Technologies on Nov. 11 for "Semiconductor component having a SiC semiconductor body" (German Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,471,336, issued on Nov. 11, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor component having a SiC semiconductor body" was invented by Andreas Peter Meiser (Sauerlach, Germany), Caspar Leendertz (Munich) and Anton Mauder (Kolbermoor, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor component includes: a SiC semiconductor body; a trench extending from a first surface of the SiC semiconductor body into the SiC semiconductor body, the trench having a conductive connection structure, a structure width at a bottom of the trench, and a dielectric layer covering sidewalls of the trench; a shielding region alo...