US Patent Issued to Infineon Technologies on Nov. 11 for "Power semiconductor module with rivet or press fit pin and method for fabricating the same" (German Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,770, issued on Nov. 11, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Power semiconductor module with rivet or press fit pin and method for fabricating the same" was invented by Ajay Poonjal Pai (Unterhaching, Germany), Tao Hong (Soest, Germany), Adrian Lis (Regensburg, Germany), Oliver Markus Kreiter (Warstein, Germany) and Matthias Rose (Kirchseeon, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor module includes: first and second substrates; at least one power semiconductor die arranged between and thermally coupled to a first side of each substrate, and electrically coupled to the first side of the f...