US Patent Issued to Infineon Technologies on May 27 for "Pre-packaged chip, method of manufacturing a pre-packaged chip, semiconductor package and method of manufacturing a semiconductor package" (Austrian, German Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,835, issued on May 27, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Pre-packaged chip, method of manufacturing a pre-packaged chip, semiconductor package and method of manufacturing a semiconductor package" was invented by Petteri Palm (Stein, Germany), Eslam Abdelhamid (Villach, Austria), Thomas Gebhard (Villach, Austria), Mahadi-Ul Hassan (Regensburg, Germany), Juan Sanchez (Villach, Austria) and Martin Henning Vielemeyer (Villach, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pre-packaged chip includes a chip having at least one electrical top contact at a top side of the chip and at least one electrical bottom conta...