ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,643, issued on May 13, was assigned to Infineon Technologies AG (Neubiberg, Germany).
"Solder stop feature for electronic devices" was invented by Ivan Nikitin (Regensburg, Germany), Adrian Lis (Regensburg, Germany), Peter Scherl (Regensburg, Germany) and Achim Althaus (Regensburg, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "Described are solder stop features for electronic devices. An electronic device may include an electrically insulative substrate, a metallization on the electrically insulative substrate, a metal structure attached to a first main surface of the metallization via a solder joint, and a concavity formed in a sidewall of...