US Patent Issued to Infineon Technologies on May 13 for "Semiconductor packages and methods for manufacturing thereof" (Malaysian, German Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,559, issued on May 13, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor packages and methods for manufacturing thereof" was invented by Si Hao Vincent Yeo (Melaka, Malaysia), Chan Lam Cha (Melaka, Malaysia), Ying Dieh Cheong (Melaka, Malaysia), Chau Fatt Chiang (Melaka, Malaysia), Cher Hau Danny Koh (Malacca, Malaysia), Wern Ken Daryl Wee (Melaka, Malaysia), Swee Kat Lee (Melaka, Malaysia), Desmond Jenn Yong Loo (Melaka, Malaysia), Fortunato Lopez (Unterhaching, Germany), Norliza Morban (Melaka, Malaysia), Khay Chwan Andrew Saw (Melaka, Malaysia), Sock Chien Tey (Melaka, Malaysia) and Mei Yong Wang (Melaka, Malaysia).

According to the abstract* releas...