US Patent Issued to Infineon Technologies on May 13 for "Antenna package with via structure and method of formation thereof" (German, American Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,874, issued on May 13, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Antenna package with via structure and method of formation thereof" was invented by Eung San Cho (Torrance, Calif.), Ashutosh Baheti (Munich) and Saverio Trotta (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device comprises a semiconductor chip comprising a radio frequency (RF) circuit, a feedline structure coupled to the RF circuit, and an antenna structure comprising a main body stretching along a direction orthogonal to at least one side of a front side and a backside of the semiconductor device, wherein the antenna structure is coupled...