ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,146, issued on March 25, was assigned to Infineon Technologies AG (Neubiberg, Germany).
"Semiconductor package" was invented by Edward Fuergut (Dasing, Germany), Ralf Otremba (Kaufbeuren, Germany), Irmgard Escher-Poeppel (Duggendorf, Germany) and Martin Gruber (Schwandorf, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided. The semiconductor package may include at least one semiconductor chip including a contact pad configured to conduct a current, a conductor element, wherein the conductor element is arranged laterally overlapping the contact pad and with a distance to the contact pad, at least one electrica...