ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,063, issued on March 25, was assigned to Infineon Technologies AG (Neubiberg, Germany).
"Method and device for producing a housing" was invented by Andreas Grassmann (Regensburg, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A device for forming a housing for a power semiconductor module arrangement includes a mold. The mold includes a first cavity including a plurality of first openings and a second opening, the second opening being coupled to a runner system, wherein the runner system is configured to inject a mold material into the first cavity through the second opening. The device further includes a plurality of sleeves or hollow bush...