US Patent Issued to Infineon Technologies on March 18 for "Embedded package with electrically isolating dielectric liner" (California Inventor)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,114, issued on March 18, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Embedded package with electrically isolating dielectric liner" was invented by Eung San Cho (Torrance, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor package includes producing a package substrate that includes an interior laminate layer, a first metallization layer disposed below the interior laminate layer, and a second metallization layer disposed above the interior laminate layer, providing a first load terminal on a first surface of the first semiconductor die and a second load terminal on a second surface of the ...