US Patent Issued to Infineon Technologies on March 18 for "Electronic device with multi-layer contact and system" (German, Malaysian Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,168, issued on March 18, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Electronic device with multi-layer contact and system" was invented by Alexander Heinrich (Bad Abbach, Germany), Michael Juerss (Regenstauf, Germany), Konrad Roesl (Teublitz, Germany), Oliver Eichinger (Regensburg, Germany), Kok Chai Goh (Melaka, Malaysia) and Tobias Schmidt (Regensburg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device with a multi-layer contact and a system is disclosed. In an embodiment, a semiconductor device includes a semiconductor substrate having a first electrode terminal located on a first surface and a secon...