US Patent Issued to Infineon Technologies on March 11 for "Semiconductor device arrangement with compressible adhesive" (German Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,561, issued on March 11, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor device arrangement with compressible adhesive" was invented by Thorsten Scharf (Lappersdorf, Germany) and Frank Singer (Regenstauf, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor package includes providing a first metal substrate; and mounting a stacked arrangement on the first metal substrate, the stacked arrangement comprising a semiconductor die, wherein mounting the stacked arrangement includes: providing a first layer of attachment material between the first metal substrate and the stacked arrangeme...