US Patent Issued to Infineon Technologies on March 11 for "Power semiconductor module, power electronic assembly including one or more power semiconductor modules, and power conversion control circuit for a power semiconductor module" (German Inventor)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,902, issued on March 11, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Power semiconductor module, power electronic assembly including one or more power semiconductor modules, and power conversion control circuit for a power semiconductor module" was invented by Jens Barrenscheen (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "A module includes: an electrically insulative housing; a driver circuit enclosed in the housing and configured to drive a control terminal of a power switch; a wireless communication circuit enclosed in the housing and configured to receive, through the housing, wireless control information transmitte...