US Patent Issued to Infineon Technologies on March 11 for "Manufacturing and reuse of semiconductor substrates" (Austrian, German Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,504, issued on March 11, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Manufacturing and reuse of semiconductor substrates" was invented by Bernhard Goller (Villach, Austria), Alexander Christian Binter (Villach, Austria), Tobias Hoechbauer (Villach, Austria), Martin Huber (Villach, Austria), Iris Moder (Villach, Austria), Matteo Piccin (Villach, Austria), Francisco Javier Santos Rodriguez (St Jakob im Rosental, Austria) and Hans-Joachim Schulze (Taufkirchen, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "pa The method of processing a semiconductor wafer includes forming one or more epitaxial layers over its first main sur...