ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,458, issued on June 17, was assigned to Infineon Technologies AG (Neubiberg, Germany).
"Package with pad having open notch" was invented by Adrian Lis (Regensburg, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package is disclosed. In one example, the package comprises an electronic component having a first main surface with an electrically conductive first pad. The first pad has an open notch, and a spacer body mounted on the first pad and bridging at least part of the open notch."
The patent was filed on Sept. 28, 2021, under Application No. 17/487,682.
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