US Patent Issued to Infineon Technologies on June 17 for "Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical device" (German Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,332,271, issued on June 17, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical device" was invented by Thoralf Kautzsch (Dresden, Germany), Steffen Bieselt (Stadt Wehlen, Germany), Heiko Froehlich (Radebeul, Germany), Andre Roeth (Dresden, Germany), Maik Stegemann (Pesterwitz, Germany), Mirko Vogt (Dresden, Germany) and Bernhard Winkler (Regensburg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A capacitive microelectromechanical device is provided. The capacitive microelectromechanical device includes a semiconductor substrate, a su...