ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,727, issued on June 10, was assigned to Infineon Technologies AG (Neubiberg, Germany).
"Chip with a silicon carbide substrate" was invented by Stefan Krivec (Villach, Austria), Ronny Kern (Villach, Austria), Stefan Kramp (Villach, Austria), Gregor Langer (Wolfnitz, Austria), Hannes Winkler (Villach, Austria) and Stefan Woehlert (Villach, Austria).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip is provided. In an embodiment, the chip includes a silicon carbide substrate, a first sputtered metal layer on the silicon carbide substrate, and at least one second sputtered metal layer on the first sputtered metal layer. The first sputtered metal layer...