ALEXANDRIA, Va., July 9 -- United States Patent no. 12,356,700, issued on July 8, was assigned to Infineon Technologies AG (Neubiberg, Germany).
"Method for splitting semiconductor wafers" was invented by Christian Beyer (Freiberg, Germany), Francisco Javier Santos Rodriguez (Villach, Austria), Hans-Joachim Schulze (Taufkirchen, Germany) and Marko David Swoboda (Dresden, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of splitting off a semiconductor wafer from a semiconductor bottle includes: forming a separation region within the semiconductor boule, the separation region having at least one altered physical property which increases thermo-mechanical stress within the separation region rela...