US Patent Issued to Infineon Technologies on July 29 for "Power module having vertically aligned first and second substrates" (German Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,661, issued on July 29, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Power module having vertically aligned first and second substrates" was invented by Adrian Lis (Regensburg, Germany), Ewald Guenther (Regenstauf, Germany) and Thomas Schmid (Regensburg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power module includes: a first substrate having a patterned first metallization; a second substrate vertically aligned with the first substrate and having a patterned second metallization that faces the patterned first metallization; first vertical power transistor dies having a drain pad attached to a first island of the pa...