US Patent Issued to Infineon Technologies on Jan. 27 for "Molded package having an electrically conductive clip with a convex curved surface attached to a semiconductor die" (Malaysian, Austrian Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,810, issued on Jan. 27, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Molded package having an electrically conductive clip with a convex curved surface attached to a semiconductor die" was invented by Wee Aun Jason Lim (Melaka, Malaysia), Marie Hazel Barozzo Gabrillo (Villach, Austria), Chai Chee Lee (Melaka, Malaysia) and Nor Haqimi Mohamed (Melaka, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A molded package includes: a semiconductor die; a substrate attached to a bottom side of the semiconductor die; an electrically conductive clip attached to a top side of the semiconductor die; and a mold compound encapsulating th...