US Patent Issued to Infineon Technologies on Jan. 20 for "Semiconductor substrate having an alignment structure" (Austrian Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,748, issued on Jan. 20, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor substrate having an alignment structure" was invented by Thomas Huber (Ossiach, Austria), Matthias Kuenle (Villach, Austria), Iris Moder (Villach, Austria) and Joerg Ortner (Drobollach am Faakersee, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor substrate includes a semiconductor base substrate. An alignment structure is formed on a surface of the semiconductor base substrate. An epitaxial layer is deposited on the surface of the semiconductor base substrate. The alignment structure includes an area of the surface of the semi...