US Patent Issued to Infineon Technologies on Jan. 20 for "Semiconductor device package thermally coupled to passive element" (American, German Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,737, issued on Jan. 20, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor device package thermally coupled to passive element" was invented by Kushal Kshirsagar (Warwick, R.I.), Eung San Cho (Torrance, Calif.), Arun Kumar Gnanappa (Regensburg, Germany), Wenkang Huang (East Greenwich, R.I.), Angela Kessler (Sinzing, Germany), Marcel Rene Mueller (Bendorf, Germany) and Stephen Pullen (Olympia, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor assembly includes a device carrier that includes a dielectric core region and a plurality of contact pads disposed on an upper surface, a semiconductor device packag...