US Patent Issued to Infineon Technologies on Jan. 20 for "Methods of splitting a semiconductor work piece" (Austrian Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,143, issued on Jan. 20, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Methods of splitting a semiconductor work piece" was invented by Benjamin Bernard (Villach, Austria), Alexander Binter (Villach, Austria) and Heimo Graf (Trebesing, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of splitting a semiconductor work piece includes: forming a separation zone within the semiconductor work piece, wherein forming the separation zone comprises modifying semiconductor material of the semiconductor work piece at a plurality of targeted positions within the separation zone in at least one physical property which increases th...