ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,018, issued on Feb. 4, was assigned to Infineon Technologies AG (Neubiberg, Germany).
"Semiconductor encapsulant strength enhancer" was invented by Georg Troska (Froendenberg/Ruhr, Germany) and Hans Hartung (Warstein, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a power electronics carrier including a structured metallization layer disposed on an electrically insulating substrate, a power semiconductor die mounted on the power electronics carrier, a housing that surrounds an interior volume over the power electronics carrier, a reinforcing structure contained within the interior volume and including a texture...