US Patent Issued to Infineon Technologies on Feb. 18 for "Method of manufacturing a package having an adhesion promoter" (German, Malaysian Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,547, issued on Feb. 18, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Method of manufacturing a package having an adhesion promoter" was invented by Edmund Riedl (Wald, Germany), Steffen Jordan (Pielenhofen, Germany), Stefan Miethaner (Regensburg, Germany) and Stefan Schwab (Singapore, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a package includes forming an adhesion promoter on at least part of an electronic component. The adhesion promoter is a morphological adhesion promoter including a morphological structure having a plurality of openings. The method further includes at least partially enc...