US Patent Issued to Infineon Technologies on Feb. 10 for "Flip chip bonding for semiconductor packages using metal strip" (Malaysian Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,751, issued on Feb. 10, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Flip chip bonding for semiconductor packages using metal strip" was invented by Chew Yeek Lau (Muar, Malaysia), Swee Kah Lee (Melaka, Malaysia), Fong Mei Lum (Melaka, Malaysia) and Kon Hoe Chin (Pusing, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming one or more semiconductor packages includes mounting one or more semiconductor dies on the metal strip such that the one or more semiconductor dies are in a flip chip arrangement whereby terminals of the one or more semiconductor dies face the upper surface of the metal strip, forming an e...