US Patent Issued to Infineon Technologies on Dec. 9 for "Semiconductor module, method for fabricating a semiconductor module, and system" (German, Austrian Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,493,059, issued on Dec. 9, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor module, method for fabricating a semiconductor module, and system" was invented by Tomas Reiter (Ottobrunn, Germany), Dietmar Spitzer (Volkermarkt, Austria), Christoph Koch (Salzkotten, Germany) and Patrik Holt Jones (Soest, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a semiconductor die, an encapsulation encapsulating the die, and first and second power contacts electrically coupled to the die. The power contacts each include an external part exposed from the encapsulation and an overlapping part. The power ...