US Patent Issued to Infineon Technologies on Dec. 9 for "Power semiconductor module and method of increasing pin alignment accuracy for power semiconductor modules" (German Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,440, issued on Dec. 9, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Power semiconductor module and method of increasing pin alignment accuracy for power semiconductor modules" was invented by Alexander Herbrandt (Soest, Germany) and Amir Al Kassou (Dormagen, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of increasing overall pin alignment accuracy for a power semiconductor module is provided. The power semiconductor module has a plurality of pins protruding from a housing of the power semiconductor module. The method includes: determining a positional deviation of each pin of the plurality of pins from a respectiv...