ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,418, issued on Dec. 9, was assigned to Infineon Technologies AG (Neubiberg, Germany).
"Power module with press-fit contacts" was invented by Ivan Nikitin (Regensburg, Germany) and Peter Luniewski (Poing, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor device includes providing a power electronics carrier including a structured metallization layer disposed on an electrically insulating substrate, mounting one or more semiconductor dies on a portion of the structured metallization layer, forming an encapsulant body of electrically insulating material that covers the power electronics carrier and encapsulates t...