US Patent Issued to Infineon Technologies on Dec. 30 for "Semiconductor packages including a package body with grooves formed therein" (Malaysian, German, Austrian Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,380, issued on Dec. 30, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor packages including a package body with grooves formed therein" was invented by Chii Shang Hong (Bukit Katil, Malaysia), Li Fong Chong (Alor Gajah, Malaysia), Yee Beng Daryl Yeow (Batu Berendam, Malaysia), Edward Furgut (Dasing, Germany), Mei Fen Hiew (Melaka, Malaysia), Azlina Kassim (Taman Bukit Cheng, Malaysia), Ralf Otremba (Kaufbeuren, Germany), Bernd Schmoelzer (Radenthein, Austria), Joon Shyan Tan (Seremban, Malaysia) and Lee Shuang Wang (Bukit Baru, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is disclosed. ...