US Patent Issued to Infineon Technologies on Dec. 30 for "Semiconductor package mounting platform with integrally formed heat sink" (German Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,383, issued on Dec. 30, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor package mounting platform with integrally formed heat sink" was invented by Timothy Canning (Regensburg, Germany) and Helmut Brech (Lappersdorf, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a mounting platform including an electrically insulating substrate and structured metallization layers, a semiconductor die mounted on an upper surface of the mounting platform, the semiconductor die including a first terminal and a second terminal, the first terminal disposed on a second surface of the semiconductor die...