ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,435, issued on Dec. 30, was assigned to Infineon Technologies AG (Neubiberg, Germany).
"Semiconductor package having a solder wetting structure" was invented by Mohd Afiz Hashim (Shah Alam, Malaysia), Zhi Yuan Goh (Bertam, Malaysia), Subaramaniym Senivasan (Bemban, Malaysia), Azmil Abdullah (Merlimau, Malaysia), Varun Parthasarathy (Johor Bahru, Malaysia), Kah Wai Lau (Duyung, Malaysia) and Ahmad Zulkarnain Samsudin (Seremban, Malaysia).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a substrate having a metallic surface; a semiconductor die metallurgically bonded to the metallic surface of the substrate by a first so...