ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,499,343, issued on Dec. 16, was assigned to Infineon Technologies AG (Neubiberg, Germany).
"Wafer-level package sensor device" was invented by Frank Puschner (Kelheim, Germany), Mark Pavier (East Grinstead, Great Britain) and Bernd Ebersberger (Egmating, Great Britain).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer-level package sensor device including a capacitive sensor, a controller which is electrically conductively connected to the sensor, wherein the capacitive sensor is formed by partially overlapping redistribution layer tracks of the wafer-level package sensor device formed in different planes, and multiple contact surfaces connected to ...