US Patent Issued to Infineon Technologies on Aug. 26 for "Pressure sensors on flexible substrates for stress decoupling" (Austrian Inventor)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,919, issued on Aug. 26, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Pressure sensors on flexible substrates for stress decoupling" was invented by Dirk Hammerschmidt (Finkenstein, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor chip including a chip substrate and a MEMS element, wherein the chip substrate includes a first surface and a second surface arranged opposite to the first surface, and wherein the MEMS element is disposed at the first surface of the chip substrate and the MEMS element includes a sensitive area; at least one electrical interconnect structure electrical...