US Patent Issued to Infineon Technologies on Aug. 12 for "Housing, semiconductor module comprising a housing and method for producing a housing" (German Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,987, issued on Aug. 12, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Housing, semiconductor module comprising a housing and method for producing a housing" was invented by Ulrich Nolten (Ruthen, Germany) and Karsten Wolff (Soest, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A housing for a power semiconductor module includes sidewalls and a top that includes a first surface extending in a first horizontal plane and a second surface opposite and in parallel to the first surface, a plurality of openings of a first kind, each of the plurality of openings of the first kind including a first through hole extending through the...