US Patent Issued to Infineon Technologies on April 8 for "Semiconductor device testing with lead extender" (Malaysian Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,270,850, issued on April 8, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Semiconductor device testing with lead extender" was invented by Soon Lai Kho (Malacca, Malaysia) and Nee Wan Khoo (Melaka, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes providing a semiconductor package including an encapsulant body and a plurality of leads that protrude out from the encapsulant body; providing a semiconductor device testing apparatus including a package holder, a plurality of contact test probes, and a lead extender; arranging the semiconductor package within the package holder; actuating the semiconductor device tes...