US Patent Issued to Infineon Technologies on April 8 for "Integrated circuit, method for manufacturing an integrated circuit, wafer and method for manufacturing a wafer" (German Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,274,076, issued on April 8, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Integrated circuit, method for manufacturing an integrated circuit, wafer and method for manufacturing a wafer" was invented by Hans Taddiken (Munich), Christoph Glacer (Munich), Dominik Heiss (Munich) and Christoph Kadow (Gauting, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit includes a transistor, a first metallization layer above the transistor and electrically connected to the transistor, and a phase change switch, wherein at least a part of the phase change switch is provided below the first metallization layer, wherein the fir...