US Patent Issued to Infineon Technologies on April 22 for "Molded semiconductor package having an embedded inlay" (German Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,538, issued on April 22, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Molded semiconductor package having an embedded inlay" was invented by Marcus Boehm (Thalmassing, Germany), Michael Fuegl (Neumarkt, Germany), Ludwig Heitzer (Falkenfels, Germany) and Stefan Woetzel (Erfurt, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A molded semiconductor package includes: a mold compound; a metal substrate partly embedded in the mold compound; at least one first metal lead partly embedded in the mold compound; an inlay embedded in the mold compound, the inlay comprising a semiconductor die embedded in an electrically insulating body...