US Patent Issued to Infineon Technologies Dresden on Nov. 18 for "Semiconductor component including an electronic component based on polycrystalline silicon" (German Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,823, issued on Nov. 18, was assigned to Infineon Technologies Dresden GmbH & Co. KG (Dresden, Germany).

"Semiconductor component including an electronic component based on polycrystalline silicon" was invented by Dirk Meinhold (Dresden, Germany) and Steffen Bieselt (Wehlen, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor component includes: a silicon-based substrate; an oxide layer atop the silicon-based substrate; an electronic component based on polycrystalline silicon; a crystalline silicon layer atop the silicon-based substrate and atop lateral faces of the oxide layer; and a lid connected to the crystalline silicon layer....