US Patent Issued to Infineon Technologies Dresden on July 15 for "Semiconductor die with pressure and acceleration sensor elements" (German Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,994, issued on July 15, was assigned to Infineon Technologies Dresden GmbH & Co. KG (Dresden, Germany).

"Semiconductor die with pressure and acceleration sensor elements" was invented by Steffen Bieselt (Wehlen, Germany) and Dirk Meinhold (Dresden, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some implementations a semiconductor die comprises a semiconductor chip. The semiconductor chip comprises a piezoresistive pressure sensor element and at least one capacitive acceleration sensor element. The piezoresistive pressure sensor element is arranged to the side of the capacitive acceleration sensor element. In some implementations, a metho...