US Patent Issued to Infineon Technologies Austria on Sept. 9 for "Semiconductor package and method of manufacturing a semiconductor package" (German Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,815, issued on Sept. 9, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Semiconductor package and method of manufacturing a semiconductor package" was invented by Thomas Beer (Mauerstetten, Germany), Daniel Hoelzl (Unterhaching, Germany), Ralf Otremba (Kaufbeuren, Germany) and Klaus Schiess (Allensbach, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a leadframe having first, second and third die pads and leads, each die pad having upper and lower surfaces; first and second power semiconductor devices; a control semiconductor device; and a mold compound. The upper surface of each die pa...